科
研究成果：
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学术论文
[1] S. Liang, H. Jiang, Z. Zhong, S. Ramachandran, Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling, IEEE Trans. Electron Devices (2023) DOI: 10.1109/TED.2023.3309280.
[2] S. Liang, C. Liu, H. Jiang, Z. Zhong, Investigation of Electric-thermal-mechanical Effects in Electric Assisted Silver Sintering Process through Phase Field Modelling, IEEE Trans. Compon. Packag. Manuf. Technol. 99 (2023).
[3] S. Liang, C. Wei, A. Kunwar, U. Subedi, H. Jiang, H. Ma, C. Ke, Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu
6
Sn
5
intermetallics under electric current stressing, Surf. Interfaces (2023) 102728.
[4] S. Liang, X.P. Zhang, Unraveling the electric field effect on the grain‐boundary migration in alumina through phase field modeling, J. Am. Ceram. Soc. 106 (2023) 1647-1652.
[5] S. Liang, M.B. Zhou, C. Ke, C. Wei, X.P. Zhang, Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation, Microelectron. Reliab. 138 (2022) 114611.
[6] S. Liang, Y. Zhong, S. Robertson, A. Liu, H. Jiang, C. Liu, Z. Zhou, C. Liu, Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding, Microelectron. Reliab. 138 (2022) 114654.
[7] S. Liang, C. Wei, C. Ke, S. Cao, M.B. Zhou, X.P. Zhang, Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via, IEEE Trans. Device Mater. Reliab. 22 (2022) 267-275.
[8] S. Liang, C. Liu, Z. Zhou, Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field, Mater. Today Commun. 31 (2022) 103408.
[9] S. Liang, A. Kunwar, C. Liu, H. Jiang, Z. Zhou, Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation, J. Mater. Res. Technol. 19 (2022) 345-353.
[10] S. Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding, IEEE Trans. Compon. Packag. Manuf. Technol. 11 (2021) 2122-2129.
[11] S. Liang, A. Kunwar, C. Wei, C. Ke, Insight into the preferential grain growth of intermetallics under electric current stressing–A phase field modeling, Scr. Mater. 203 (2021) 114071.
[12] S. Liang, C. Ke, C. Wei, J.Q. Huang, M.B. Zhou, X.P. Zhang, Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress, J. Mater. Res. 34 (2019) 2775-2788.
[13] S. Liang, C. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Phase field modeling of grain boundary migration and preferential grain growth driven by electric current stressing, J. Appl. Phys. 124 (2018) 175109.
[14] S. Liang, C. Ke, W. Ma, M.-B. Zhou, X.P. Zhang, Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects, Microelectron. Reliab. 71 (2017) 71-81.
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会议报告
[1]
梁水保
, 3D
封装微凸点焊点界面
IMC
在物理场下优先生长的机制研究
, 2023
电子封装材料与测试技术创新大会
,
贵阳
,
中国
, 10
月
20-22
日
, 2023,
邀请报告
.
[2] S. Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, Investigation of thermo-mechanical and phase-change behavior in the Sn/Cu interconnects during self-propagating exothermic reaction bonding, The 70th Electronic Components and Technology Conference (ECTC), IEEE, Orlando, FL, USA, May. 30-Jun. 3, 2020, pp. 269-275.
[3] S. Liang, C.Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects, The 15th International Conference on Electronic Packaging Technology, IEEE, Chengdu, Aug. 12-15, 2014, pp. 641-645.
[4] S. Liang, C. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects under electric current stressing, The 66th Electronic Components and Technology Conference (ECTC), IEEE, Las Vegas, NV, USA, May. 31-Jun. 3, 2016, pp. 264-270.
[5] S. Liang, C. Ke, M.Y. Tan, M.B. Zhou, X.P. Zhang, Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects, The 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Wuhan, Aug. 16-19, 2016, pp. 836-840.
[6] S. Liang, X.P. Zhang, C. Wei, C. Ke, C. Liu, Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling, The 7th Electronic System-Integration Technology Conference (ESTC), IEEE, Dresden, Germany, Sep. 18-21, 2018, pp. 1-7.
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科研获奖
